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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Cyient Inaugurates Wire Harness Lab for Production and Prototyping in its Peoria Office
February 17, 2020 | CyientEstimated reading time: 1 minute
Cyient, a global engineering and technology solutions company, today announced that it has opened a wire harness facility in its office in Peoria Heights, Illinois. The facility complements the company's design, build, and maintain approach, and adds capabilities to support customers in harness prototyping by increasing design process speed and iterative development for electrical systems.
The 1,100 sq ft, restricted-access lab is equipped with pneumatic crimping tools, including an ultrasonic splicer and braider, to facilitate quality production and prototypes for electrical wire harnesses. Harness rework, testing, field installation, and troubleshooting are additional services that Cyient will offer from the new facility. While the facility has been launched with a single, nine-hour shift, the company will expand operations for 24/7 support in the future.
Demonstrating its continued commitment to quality and safety, Cyient is working toward the Wiring Harness Manufacturer's Association Certification, bringing extended value to its prototyping capability. The company's move to add this facility provides customers in North America ready access to time-sensitive wire harness prototype products and field support.
Commenting on the capability, Gordon Hilbun, Head of Cyient's Industrial Business, said, "This is a critical addition to our portfolio and will help us offer full product life cycle support to our customers, especially for time-critical new product introduction requirements. Our new wire harness lab strengthens our electronics and electrical solution offering, addressing the demand for end-to-end support."
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Dragonfly Energy Secures Additional Nevada Tech Hub Funding
05/07/2026 | Globe NewswireDragonfly Energy Holdings Corp., an industry leader in energy storage and maker of Battle Born Batteries®, announced it has been selected for a second consecutive round of funding through the Nevada Tech Hub.
Designing Without a Rulebook: When Engineering Becomes Innovation
05/05/2026 | Stephen V. Chavez, Siemens EDAWhat if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
Custom LIDAR Optics Support Mission-Critical Performance
05/05/2026 | PRNewswireMeller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.