-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs
January 8, 2020 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that an implementation of the Low Complexity Communications Codec (LC3) that is expected to be compliant with LE Audio, the next generation of Bluetooth audio, is available now for Cadence® Tensilica® HiFi DSPs and has been delivered to a lead customer. LC3 provides higher audio quality at lower bandwidth and affords developers greater flexibility in making tradeoffs between audio quality, power consumption and other features for a more optimal user experience. Cadence licensed reference code from Fraunhofer IIS to enable availability of LC3 in conjunction with the initial LE Audio launch, allowing customers to immediately benefit from the latest enhancements including longer battery life, improved connectivity and multi-user sharing.
“Consumer demand for a wide range of Bluetooth audio-based products from headphones and TWS ear buds to portable speakers continues to explode. We are excited that our contributions to LC3 help deliver higher quality and more robust experiences,“ said Marc Gayer, head of business department in the audio and multimedia division of Fraunhofer IIS. “We worked early on in the development of the codec to ensure that LC3 would run extremely efficiently on the Cadence Tensilica HiFi Audio DSP architecture, which translates to extended battery life for consumers.”
“The fact that the LC3 codec can provide very high-quality audio even at low bitrates makes it a key feature of the upcoming LE Audio standard,” said Mark Powell, executive director of the Bluetooth Special Interest Group (SIG). “We are pleased to see member companies working on implementations of the LC3 codec optimized for various processor architectures.”
“Fraunhofer continues to prove that it is an innovative leader in the world of audio/voice codecs with its critical contributions to the new LC3 standard,” said Gerard Andrews, director of audio/voice IP marketing at Cadence. “By working closely with Fraunhofer throughout the development of this audio codec, we are able to offer a highly optimized, ultra-low power implementation on the HiFi architecture in concert with the announcement of LE Audio. This is an example of how we’re continuing to enhance our best-in-class HiFi technology to deliver performance excellence for our customers’ audio and voice implementations.”
Tensilica HiFi DSPs are the most widely licensed audio/voice/AI speech processors. Part of the broad Cadence IP portfolio, they enable SoC design excellence in support of Cadence’s Intelligent System Design™ strategy. For more information on the Tensilica HiFi DSP family, visit http://ip.cadence.com/ipportfolio/tensilica-ip/audio.
Suggested Items
Process Yield Statistics and Distributions
11/25/2024 | Dr. Pat Valentine, UyemuraThe costs of poor quality include all expenses incurred for not making or providing a perfect product the first time, including scrap, rework, re-purchasing raw materials, labor, and inventory. Companies operating at a three-sigma quality level can spend about 25% of their annual sales remediating poor quality costs. Other estimates put the costs of poor quality in the range of 25–40%. Poor quality can destroy a company.
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management
11/26/2024 | Anaya Vardya -- Column: Standard of ExcellenceIn continuing my series on finding, signing, and keeping good people for your company, this month we discuss hiring good people for your quality department. Even when hiring was easier, hiring for the quality department has always been especially challenging. It takes a special kind of person: someone with attention to detail, someone ready to stand for his or her convictions, and someone who can stand up under pressure when the company needs to ship product and the quality manager refuses to because it is not up to par. The quality department is the very soul of any manufacturing company.
ViTrox Americas Expands Reach in Southern U.S. with MaRCTex
11/21/2024 | ViTroxViTrox Americas Inc. is pleased to announce the appointment of MaRCTex Inc. as its new representative for the states of Texas, Louisiana, Oklahoma and Arkansas. Led by industry veteran Mike Gunderson, MaRCTex has a proven track record of supplying essential tools and solutions for the electronics manufacturing and high-tech industry across the United States. Additionally, demos are available at the ViTrox Americas Demo Center in Hutto, Texas.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.