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Suggested Items

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.

The Hidden Enabler of Autonomous Warfare: Advanced PCB Technologies Behind Defense AI

06/16/2026 | Jesse Vaughan -- Column: Beyond the Board
Autonomous systems are rapidly reshaping the defense landscape. Unmanned aerial systems, autonomous maritime vessels, robotic ground vehicles, loitering munitions, and AI-enabled sensing platforms are now integral components of modern military operations. AI may serve as the brain of an autonomous system, but advanced PCBs form the foundation that allows those capabilities to operate reliably in the field.

Follow the Story: The Chemistry Behind PCB Fabrication

06/16/2026 | I-Connect007 Editorial Team
Many of the decisions that shape reliability, yield, sustainability, and cost happen long before a board reaches final inspection. The choice of metallization process, surface finish, water treatment strategy, or etching approach can significantly impact manufacturing outcomes. Here are four articles worth revisiting that tackle different aspects of the same conversation: the chemistry and processes behind modern PCB manufacturing.

From Dilution to ZLD: Optimizing Used Process Water Management

06/10/2026 | Richard Nichols, GreenSource Engineering
Last month, we began discussing the journey from dilution to zero liquid discharge. I highlighted that approximately 70% of the used process water (UPW) is generated from the dilute stream. This significant volume underscores the necessity for effective treatment processes that ensure the safe return of water into the production cycle while minimising environmental impact.

Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

06/09/2026 | Cadence Design Systems
Cadence announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A.
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