-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Raytheon-Built Space Sensor Will Fly Aboard NASA Satellite to Measure Coastal and Ocean Ecosystems
August 26, 2019 | PRNewswireEstimated reading time: 1 minute
Raytheon will build the Geostationary Littoral Imaging and Monitoring Radiometer, or GLIMR, sensor, under a contract from the University of New Hampshire. GLIMR, NASA's selected Earth Venture Instrument-5 investigation, will be NASA's first hyperspectral imager in geostationary, or GEO, orbit. Hyperspectral imaging collects and processes information from across the electromagnetic spectrum including visible light, infrared and ultraviolet frequencies to create a highly detailed view of physical and biological conditions in coastal waters.
The instrument will provide high-sensitivity, high-spatial and high-temporal resolution measurements of coastal and ocean ecosystems in the Gulf of Mexico, parts of the southeastern U.S. coastline and the Amazon River plume. Decision-makers will use the GLIMR data to respond rapidly to natural and manmade coastal water disasters, such as harmful algae blooms and oil spills. It will also help improve the coastal ecosystem's sustainability and resource management.
"GLIMR will collect the sharpest and most colorful view of physical and biological conditions in coastal waters ever seen from GEO," said Jeff Puschell, GLIMR instrument scientist and principal engineering fellow at Raytheon Space Systems. "A hyperspectral imager is essential technology to capture new insight about our changing coastal ecosystems."
The University of New Hampshire is NASA's lead organization for the GLIMR contract. The instrument will launch aboard its host spacecraft in the 2026-2027 timeframe. Its data will be available to scientists, researchers and educators around the world.
About Raytheon
Raytheon Company, with 2018 sales of $27 billion and 67,000 employees, is a technology and innovation leader specializing in defense, civil government and cybersecurity solutions. With a history of innovation spanning 97 years, Raytheon provides state-of-the-art electronics, mission systems integration, C5I products and services, sensing, effects, and mission support for customers in more than 80 countries. Raytheon is headquartered in Waltham, Mass.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
GlobalFoundries, Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
11/05/2025 | GlobalFoundriesGlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, and Silicon Labs, the leading innovator in low-power wireless, announced the expansion of their strategic partnership to advance the development of next-generation, energy-efficient wireless technologies and scale U.S.-based semiconductor manufacturing.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
On the Line With… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.