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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Lite-On Tech to Wholly Own Japan Subsidiary
June 5, 2019 | DigitimesEstimated reading time: 1 minute
EMS provider Lite-On Technology will acquire the remaining 50.51% stake in Lite-On Japan (LOJ), its subsidiary listed on JASDAQ, through open purchases of all of 6.290 million outstanding LOJ shares at JPY240 ($2.22) per share during June 4-July 16, with total purchase price estimated at JPY1.51, Digitimes reported.
It said it is integrating Lite-On Group's resources and hiking operation efficiency. It added LOJ does not need much capital from the stock market.
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EPTAC Expands. New HQ in Salem, NH, Draws Industry Leaders
04/30/2026 | EPTAC CorporationEPTAC, a global leader in electronics manufacturing training, has opened its new corporate headquarters and training facility in Salem, New Hampshire, expanding its capacity to support workforce development across North America.
A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'
04/23/2026 | I-Connect007 Editorial TeamI-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time with… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.
Women in Electronics Keynote Review: A Life and Career Filled With Humor
04/03/2026 | Michelle Te, I-Connect007In an industry that was dominated by male comedians, Jan McInnis quickly learned an important tip to help her succeed in the business: Don’t ask for permission to be yourself. “Don’t try to be something you’re not,” she said after headlining the Women in Electronics event at APEX EXPO 2026. “They’re paying for you and what you bring to the table, so put your blinders on, and just do your thing.”
Educational Highlights From the APEX EXPO 2026 Show Floor
03/27/2026 | Kimberly Kutnick, Global Electronics AssociationAPEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.
Webinar Review, Part 1: A Packaging Revolution Powering the Next Era of AI Compute
03/15/2026 | Marcy LaRont, I-Connect007The rapid rise of artificial intelligence has fundamentally reshaped the demands placed on semiconductor technology, and nowhere is it more evident than in advanced electronic packaging. A recent episode of the Global Electronics Association’s Executive Pulse webinar series, featuring Dr. Hemanth Dhavaleswarapu of AMD as the first of two esteemed presenters, provided a comprehensive overview of chip-level packaging. He outlined the evolution of AI workloads in forcing a rethinking of everything from chip architecture to data center design, with packaging now playing a central role in enabling continued performance scaling.