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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Foxconn Research Develops 34.1 Tbps Silicon Photonics Technology

07/30/2026 | Foxconn
Foxconn Research Institute, in collaboration with National Yang Ming Chiao Tung University, has developed a 34.132 Tbps ultra-high-capacity silicon photonics transmission technology designed to address growing data bandwidth demands driven by artificial intelligence (AI).

SIA Commends CHIPS Awards to Accelerate Advanced Compute Semiconductor R&D

07/30/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding seven R&D awards announced by the CHIPS Research and Development Office (CRDO) to accelerate semiconductor R&D for the advanced compute supply chain.

Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap

07/29/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.

QTREX Launches Quantum Interconnect Research Program

07/28/2026 | Globe Newswire
QTREX Quantum Ltd. a company focused on advancing Additively Manufactured Electronics (AME) for quantum computing infrastructure announced the launch of a research collaboration with Northeastern University in Massachusetts, focused on advanced micro-system structures for cryogenic quantum interconnects.

PNNL Strengthens U.S. Supply of Key Feedstock for Quantum Technologies

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A research team at the Department of Energy’s Pacific Northwest National Laboratory has successfully designed and built high-purity gas conversion and purification systems for silane and germane.
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