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Advanced Electronics Packaging Digest

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CEA-Leti, GlobalFoundries Advance European FD-SOI Innovation via FAMES Pilot Line

06/11/2026 | CEA-Leti
CEA‑Leti, a leading European research institute for microelectronics, reaffirmed its long‑standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two decades of joint work on fully depleted silicon‑on‑insulator (FD‑SOI) technology and reinforcing Europe's leadership in energy‑efficient, sovereign semiconductors.

Rice Joins Axiom Space’s University Alliance

06/10/2026 | Rice University
Rice University has joined Axiom Space’s University Alliance, comprising 26 institutes from four continents and 12 nations working as an international network dedicated to advancing microgravity research, technology development and commercial innovation in low-Earth orbit.

PC GPU Shipments Fall 7.5% in Q1'26; Data Center GPUs Up 19%

06/05/2026 | Jon Peddie Research
Jon Peddie Research reports the global PC-based graphics processor unit (GPU) market reached 70.3 million units in Q1’26 and PC CPU shipments decreased to 57.6 million units.

Fujitsu, Daiichi Life Launch Joint Research on Quantum-Powered Asset Management

06/04/2026 | Fujitsu
Fujitsu Limited and Daiichi Life Group, Inc. announced that they conduct joint research from April 2026 to March 2027 to advance asset management operations through the application of quantum technology in the insurance sector.

TACC Limited, NUS I-FIM Sign MOU to Advance Next-Generation Materials

06/02/2026 | PRNewswire
TACC Limited, an LNJ Bhilwara Group company and wholly owned subsidiary of HEG Limited, has signed a Memorandum of Understanding (MOU) with the Institute for Functional Intelligent Materials (I-FIM) at the National University of Singapore (NUS) to collaborate in the fields of advanced materials science, nanotechnology, and related disciplines.
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