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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Federal Electronics Expands Environmental Testing Capabilities with New Extended-Range Thermal Test Chamber

06/08/2026 | Federal Electronics
Federal Electronics, a leader in providing advanced electronic manufacturing services, announced the addition of a new in-house environmental test chamber designed to support the reliability, qualification, and validation requirements of high-performance electronic products.

UCLA Joins Southwest Consortium to Expand Microelectronics Training

06/08/2026 | UCLA
UCLA is joining a major new regional initiative to strengthen the semiconductor and microelectronics workforce pipeline across the Southwest.

Infineon Transfers Tijuana, Mexico Backend Production to Other Sites

06/08/2026 | Infineon
Infineon Technologies AG is realigning its manufacturing footprint in Mexico. The company will gradually transfer production from its site in Tijuana, Mexico, to other sites, strengthening overall scalability, productivity and competitiveness.

MKS’ Atotech, ESI to Highlight Integrated PCB and Advanced Packaging Solutions at JPCA 2026

06/08/2026 | Atotech
MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will present their latest innovations in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at the JPCA Show in Tokyo, Japan, from June 10-12.

GreenSource Fabrication to Showcase Advanced PCB Manufacturing Capabilities at IMS 2026

06/05/2026 | GreenSource Fabrication
GreenSource Fabrication today announced that it will exhibit at IMS 2026, the IEEE International Microwave Symposium (IMS), taking place June 7–13, 2026, at the Thomas M. Menino Convention and Exhibition Center in Boston, Massachusetts.
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