Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Frontline Releases InCAM 2.32
January 22, 2016 | Frontline PCB SolutionsEstimated reading time: 2 minutes
Released on January 10, 2016, InCAM 2.32 is a minor new version that introduces numerous workflow throughput enhancements, including the ability to run Step Compare in the background and to add multiple dimensions simultaneously. In addition, two new DFM functions improve the production process for HDI and IC-packaging boards.
New Features
Reduce the galvanic effect during the gold plating process
Run the new Non-Tieline Gold Galvanic Compensation DFM to calculate the gold/copper or copper/gold ratio that is below a defined threshold and take steps to reduce the galvanic effect during gold plating.
Apply etch compensation to the narrow parts of a surface
Use the new Patch Bottlenecks DFM to automatically detect locations where surface width is below the defined value and apply a patch to these locations, enabling the application of etch compensation to the narrow parts of a surface.
Quickly create dimensioned drawing with multiple dimensions
Create dimensioned drawings faster – (co)ordinate, linear or baseline dimensions – by adding multiple dimensions at the same time.
Get Step Compare results per layer as soon as they’re ready
Run Step Compare in the background while getting on with other tasks. Step Compare can run in parallel on different layers, delivering results one by one as they become ready, while the remaining layers continue processing.
Improved sub-assembly electrical testing
Optimize netlists and create an electrical testing program for sub-assembly testing.
Page 1 of 2
Share on:
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.