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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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GSME Joined TSMC OIP Value Chain Alliance in North America

09/16/2026 | PRNewswire
GS Microelectronics U.S., Inc. (GSME), a leading semiconductor solutions provider, announced it has officially joined TSMC's Open Innovation Platform® (OIP) Value Chain Alliance (VCA) as a member partner in North America.

Boeing: Africa’s Airplane Fleet to More Than Double by 2045

09/08/2026 | Boeing
Africa’s young, increasingly urban population, growing middle class and improving infrastructure will drive passenger traffic to grow nearly 6% annually through 2045, one of the fastest rates globally, Boeing  said.

Pharmaceutical EMS Market to Reach $51.9B by 2031, Growing 8.1% CAGR

08/19/2026 | Globe Newswire
The global pharmaceutical electronic manufacturing services (EMS) market is projected to increase from USD 32.69 billion in 2025 and USD 35.17 billion in 2026 to USD 51.91 billion by 2031.

RTX's Collins Aerospace to Support U.S. Army Chinook Modernization

08/18/2026 | RTX
The U.S. Army awarded Collins Aerospace, an RTX business, a contract worth up to $472 million to provide engineering services that support the modernization and sustainment of the CH‑47 Chinook fleet.

Rocket Lab Satellites Reach Orbit to Support Globalstar Direct-to-Device Services

08/17/2026 | Globe Newswire
Rocket Lab Corporation, a global leader in launch services and space systems, announced the successful launch of eight advanced satellite platforms the Company built for MDA Space, prime contractor for the replenishment of Globalstar’s existing constellation, which provides direct-to-device communications services and IoT applications from orbit.
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