-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: 1 minute

Challenges of Electrical Test
Challenges to electrical test are many, but a few come to mind as the most challenging. What do you think they are? Here’s what I think:
3. Pitch and density
2. Volume
And the #1 most challenging attribute to electrical test: soldermask! In our arena today, we can solve pitch and density with flying probe machines, and volume with our grid testers, but the catalyst that is in the mix is that pesky soldermask! So why do I bring up that necessary process as a problem for electrical test?
Electrical test is an absolute science test based on mathematics and absolutes. Frontend systems rasterize the given data to absolutes. If the IPC, Gerber, and ODB++ data show the alignment of layers to the mask, it is an absolute measurement. There are no easements for registration. The test points are assigned to the product based on the absolute clearance allowed in the “Golden” data supplied in the CAD Reference.
But there is a disconnect.
To be blatantly accurate, it never happens. The phenomenon of via cap, via fill and zeroheight via fill all come in to play to change the whole game regardless of what the OEM designed. Tolerances are never considered.
Read the full column here.Editor's Note: This column originally appeared in the January 2015 issue of The PCB Magazine.
More Columns from Testing Todd
Testing Todd: Why 4-wire Kelvin?Testing Todd: Why TDR?
Testing Todd: Positivity Boosts Employee Morale
Testing Todd: Preparing Employees for the Long Haul
Testing Todd: Where Can We Improve?
Testing Todd: Turning Into the Wind
Testing Todd: Coming Back to Life—Design Recovery
Testing Todd: Decision Time—Invest or Delegate?