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Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, will showcase a portfolio of advanced materials and solutions designed to address growing thermal, power, connectivity and reliability demands across AI infrastructure, semiconductor manufacturing, automotive and high-performance computing applications at electronica 2026.
As AI infrastructure, advanced computing and high-speed connectivity continue to drive higher power densities and more demanding operating environments, engineers face growing challenges in efficient system design, manufacturing scalability and performance under increasingly complex conditions. Aligned with the event's theme, "Electronics as the Basis for the All Electric Society," Qnity will demonstrate how its broad portfolio and application expertise help customers address these challenges through integrated solutions that span thermal management, power distribution, connectivity, electromagnetic compatibility and system reliability from design through production.
A key highlight of the exhibit will be a live demonstration featuring Laird™ EMI form-in-place dispensing gasket on the DATRON evo 600 platform. The demonstration will show how Laird™ dispensable materials, including EMI shielding gaskets and thermal liquid gap fillers can help improve EMI shielding and thermal management in increasingly compact electronic systems while supporting the precision, process control and scalability required for advanced manufacturing environments.
Qnity will also showcase its new Kalrez® 7080 high-temperature sealing solutions, engineered for semiconductor processes operating at temperatures up to 330°C. Additional Kalrez® technologies designed for advanced plasma processing, high-temperature manufacturing and critical sealing applications will also be featured.
Other technologies on display will include Laird™ thermal management materials for AI servers and high-density memory applications; advanced interconnect solutions featuring Pyralux® flexible laminates and Laird™ high-performance temperature sensing and EMI shielding technologies to support effective thermal transfer and EMI attenuation within EV power electronics technologies; Qnity silicone-based materials for LED and semiconductor advanced packaging; and Emblem™ next-generation polishing pads and Optivision® Max soft pads for chemical mechanical planarization (CMP), enabling yield and process improvements across advanced nodes and device architectures.
Together, these technologies demonstrate how Qnity helps customers overcome increasingly complex thermal, power, connectivity and reliability challenges while accelerating the development and scalable production of next-generation electronic systems.
