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Advanced Electronics Packaging Digest

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Teledyne Brown Wins Next Generation Interceptor Support Equipment Subcontract

11/09/2026 | BUSINESS WIRE
Teledyne Brown Engineering, Inc., a subsidiary of Teledyne Technologies Incorporated and a leader in advanced engineering and manufacturing solutions, was awarded a sub-contract by Lockheed Martin in support of the Next Generation Interceptor (NGI) mission. Under the award, Teledyne will deliver NGI mechanical ground support equipment to Lockheed Martin.

Qnity Showcases Next-Generation Electronics Solutions at electronica 2026

11/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, will showcase a portfolio of advanced materials and solutions designed to address growing thermal, power, connectivity and reliability demands across AI infrastructure, semiconductor manufacturing, automotive and high-performance computing applications at electronica 2026.

Ventec, MICAM to Establish European CCL Joint Venture in Ireland

11/09/2026 | Ventec
Ventec International Group, a Taiwanese specialist manufacturer of copper-clad laminates (CCL) and prepregs (PP) serving a global customer base, and MICAM a long-established manufacturer of advanced composites to the industrial, security and defence industries are developing a joint venture to establish copper-clad laminate production at MICAM’s manufacturing facility in Mallow, Ireland.

Finetech Expands Volume Production Portfolio, Appoints André Thiemann Co-CEO

11/06/2026 | Finetech
Finetech, a supplier of high-precision die bonding systems for advanced packaging and heterogeneous integration, is expanding its management team: André Thiemann became Co-CEO on November 1.

IPC K-FEST 2026 Brings AI, Manufacturing and Standards into Focus

11/06/2026 | Global Electronics Association
Organized by the Global Electronics Association with support from Korea Testing Laboratory (KTL), the fourth IPC Korea Festival of Electronics Standards and Technology (IPC K-FEST 2026) took place in Seoul on November 3.
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