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Teco Electric participated in Foxconn Technology Day for the second time, focusing on its Modular Data Center (MDC ) concept developed in cooperation with Foxconn. The MDC is based on the NVIDIA DSX POD reference design. It integrates IT cabinets, cooling and power distribution systems through a 40- foot container , demonstrating its one-stop integrated delivery capability from key equipment to electromechanical engineering. Following the establishment of a strategic alliance with Foxconn ( 2317 ) through a share swap last year, Teco continues to deepen its cooperation with Foxconn, leveraging the synergy of vertical integration to seize the infrastructure business opportunities driven by the demand for AI computing power. Teco Chairman Li Mingxian said that AI is reshaping the global industrial competition landscape, and data centers have become a key infrastructure supporting the development of computing power and industrial upgrading. Teco connects power, cooling, engineering and energy management with modular solutions, and through the acquisition of Dynaciate Malaysia ( now renamed TECO NXG Integrated Services Sdn. Bhd.) , it is accelerating the group's transformation into an " AI data center solution provider". By expanding its modular data center engineering capabilities and completing over 80% of the modularization work in the factory, delivery time is effectively shortened, helping customers accelerate deployment and enhance competitiveness.
Modular integration accelerates the deployment of serial equipment manufacturing and engineering delivery
The " All-in-One MDC " concept showcased at the event is based on the NVIDIA DSX POD reference design. Using a 40- foot container, it integrates IT cabinets, AC/DC control panels, cooling systems, an energy management system ( EMS ), and fire protection equipment, demonstrating the integrated configuration of computing equipment and electromechanical infrastructure. Teco is committed to becoming a "modular data center infrastructure and electromechanical integration partner" for its customers, combining its core capabilities in power equipment, cooling and heat dissipation, and module manufacturing to provide integrated solutions that support the high-density computing needs of AI .
NVIDIA DSX POD is a reference design that allows partners to build a complete NVIDIA Vera Rubin AI factory in modular containers and complete integration and validation before delivery. DSX POD integrates and installs computing, networking, cabling, rack-level power supply, and liquid cooling systems at the manufacturing stage, reducing the significant planning, construction, professional manpower, and logistics costs required for traditional on-site construction, thereby accelerating the deployment of AI factories.
In addition to collaborating with Foxconn on the modular data center ( MDC ) concept based on DSX POD , Teco's overall MDC solution encompasses five core modules: IT , cooling, power, generators, and EMS. These modules can be flexibly configured according to customer needs, site conditions, and reliability requirements. Through modular design and factory prefabrication, some on-site assembly work is moved to the factory, followed by on-site installation and system integration, which helps reduce construction complexity and improve project quality and delivery efficiency. Customers can also build and expand in stages according to their computing power needs, allowing the deployment scale to be flexibly adjusted as business grows. Currently, Teco is implementing a MW- level modular data center project in Malaysia, putting the above integrated model into practice to respond to the needs of large cloud service providers for rapid deployment and flexible expansion. It is expected to be completed and demonstrated by the end of this year.
Integrating power and thermal management to support high-density AI computing
Teco has long been deeply involved in data center infrastructure construction, with a cumulative construction capacity of 1GW , possessing rich engineering achievements and system integration experience. As AI computing density continues to increase, stable power supply and efficient heat dissipation have become key to data center design, increasingly relying on the synergistic integration of power and cooling systems. In conjunction with this MDC exhibition, Teco is also showcasing its 800VDC high-voltage direct current power supply architecture and solid-state transformer ( SST ) technology, demonstrating its technological direction in reducing power transmission and conversion losses, and supporting the power supply needs of high-density server racks through the electrical isolation function of SST .
In terms of cooling systems, Teco integrates CDU pumps with industrial flat wire power modules, PCW process cooling water systems, and integrated dual-cooling high-efficiency chiller (heat pump) units, connecting the cooling cycle from the server end to the facility end. Through high-efficiency power, pipeline integration, and coordinated configuration of the main unit and centralized control system, it addresses the heat dissipation, space configuration, and modular expansion needs of high-density cabinets, demonstrating its technological strength extending from critical equipment supply to integrated power and thermal management for data centers.
Core electric drive technology extends to physical AI, expanding robot applications
In addition to its modular data center integration solution, TECO also showcased its M1 / M2 multi-legged robot joint module, TJM humanoid robot bionic joint module, and UTX customized high-performance joint module, respectively addressing application needs such as high-dynamic motion, full-body joint control, and heavy load. These modules are expected to be applied in fields such as multi-legged mobile robots, humanoid robots, industrial automation, and smart logistics, demonstrating TECO's development potential in expanding from traditional electromechanical equipment to physical AI, based on its core electric drive technology .
