Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/09/2026 | Nolan Johnson, I-Connect007
Have you ridden in a robotaxi yet? Increasingly, there are sightings in some of the major cities here in the western U.S, particularly San Francisco. This past week, we published a news item from Berg Research projecting that robotaxis will grow from 6,500 deployments today to more than 1.5 million over the next 10 years. The technology for fully autonomous vehicles continues to look like an emerging tech driver for the EV sector.

Third Annual Pan-European Design Conference Important for Europe

10/08/2026 | Marcy LaRont, I-Connect007 Magazine
The Pan-European Design Conference has quickly established itself as a premier event for the European electronics design community. Now in its third year, PEDC, set for Jan. 27-28, 2027, in Amsterdam, has already attracted a record number of technical paper submissions. In this interview, Susan Kayesar, a product manager at Siemens who is an active participant in IPC design standards, discusses the upcoming conference and the trends driving its continued growth.

IPC Standards Support Professional Assessment for the Electronics Competition at WorldSkills Shanghai 2026

10/05/2026 | Global Electronics Association
The 48th WorldSkills Competition was held in Shanghai from September 22 to 27, concluding on September 27. According to the official competition results, Wu Tong of China won the gold medal in the Electronics competition, marking China’s fourth consecutive gold medal in this category.

Marcy’s Musings: A World of Difference

09/17/2026 | Marcy LaRont -- Column: Marcy's Musings
I've spent a good deal of time in Asia over the years, both traveling and living there, so arriving in Thailand for THECA wasn't my first experience stepping into another culture or another way of doing business. Still, there is something about being there—moving through a different city, sitting down with people, listening to their conversations, and watching how they approach familiar challenges—that gets me thinking.

An Open Invitation to Standards Development in Paris

09/14/2026 | Marcy LaRont, I-Connect007
The Global Electronics Association is doing something a little different around standards this year. IPC Builds, Sept. 19–24, in Paris, is a series of standards development meetings open to both Association members and nonmembers, offered at no charge, with lunch provided. Sponsoring an event like this at no charge caught my attention. Removing any registration cost clearly removes a barrier to participation at a time when global input into standards development is needed more than ever. An open forum naturally makes it easier for someone who is curious about standards work or has wanted to get involved but hasn’t yet taken the first step to experience the process firsthand, with no risk or expectation.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in