Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a range of innovative, high-reliability solder products at the SMTA Guadalajara Expo and Tech Forum, October 7-8, in Guadalajara, Mexico.
The company will feature the following products:
- Durafuse® HR is a trusted and proven solder paste alloy technology delivering enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Durafuse® LT is an award-winning solder paste alloy system that delivers exceptional HiP resistance and high reliability at lower reflow temperatures. It is ideal for assemblies with broad temperature gradients and large BGAs with complex warpage profiles, effectively mitigating HIP defects caused by package warpage.
- Indalloy®302 is a low-silver solder specifically engineered to balance cost efficiency with long-term reliability. It delivers improved thermal cycling, wetting, and voiding performance (less than 10%) compared with SAC305 while supporting lower or equivalent reflow temperatures.
- Indium12.9HF is a no-clean, halogen-free solder paste designed for fine-pitch printing, including 01005 and 008004 components. With excellent HIP resistance and wetting performance, it helps accommodate package warpage while delivering low voiding at BGA, CSP, LGA, and QFN. It also provides high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
- Indium9.9TF is a no-clean, halogen-free solder paste for fine-feature printing. It delivers unprecedented stencil transfer efficiency to boost SPI yields, best-in-class voiding performance, and high oxidation resistance—preventing graping on pads as small as 175 microns.
To learn more about Indium Corporation’s Durafuse® Technology and PCB assembly portfolio, meet our company experts at SMTA Guadalajara, booth 702.
