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As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power performance challenges at the IMAPS Symposium 2026, September 29-October 1, in Boston, Massachusetts.
September 30, 11:30-11:55 a.m. EDT – Novel Interconnect Materials for Advanced Packaging Assembly Processes, presented by Sze Pei Lim, Senior Global Product Manager, Semiconductor and Advanced Materials.
This presentation will cover innovative materials for advanced packaging and heterogeneous integration, including novel ultra-low residue flux formulations for flip-chip-attach that are compatible with underfill and molding compounds, an adhesive agent for fluxless soldering, and solder paste for ultra-fine-pitch printing. These novel materials are critical enablers for high-density packaging applications. Use cases for high-density SiP modules, TCB and LAB, for advanced packaging, and 2.5D modules will also be discussed.
September 30, 13:00-13:25 EDT – Material Solutions for AI/HPC Packaging from Wafer Bumping to System Assembly, presented by Jason Chou, Senior Area Technical Manager.
This session introduces specialized materials designed to address solder joint integrity, thermal management, and other vulnerabilities to enable better AI performance. Solutions presented include ultra-low residue flux materials for micro-bump wafer bumping and Chip-on-Wafer processes, mid-temperature solder pastes to eliminate Head-in-Pillow (HIP) and Non-Wet-Open (NWO) defects, and advanced thermal interface materials (TIMs) designed to significantly enhance the thermal efficiency of high-performance computer (HPC) chips.
September 30, 13:30-13:55 EDT – A Bi-free, In-containing, Lower-temperature Solder Applicable in Large BGA Assembly for HPC, presented by Hongwen Zhang, Ph.D., Research and Development Director and Principal Metallurgist.
This presentation introduces a Bi-free, indium-containing, lower-temperature solder paste designated “DFLT” that was developed to enable hierarchical assembly with enhanced mechanical and electrical reliability. It will highlight DFLT’s dual-powder formulation and successful use across step soldering, hot bar soldering, rework, and board-level assembly. With peak reflow temperature as low as 210°C, DFLT can help mitigate warpage-related defects in large BGA assemblies while delivering significant improvements in drop-shock resistance and electromigration performance compared with bismuth-tin-silver (BiSnAg) alloys and providing performance comparable to or exceeding SAC305.
About the Presenters
Jason Chou provides technical support to Indium Corporation’s customers focusing on the semiconductor industry. His strategic location in southern Taiwan provides timely customer response, as well as efficient sales and marketing team support. He holds a bachelor’s degree in chemistry from National Cheng Kung University, Taiwan, and a master’s in chemistry from National Tsing Hua University, Taiwan.
Sze Pei Lim works closely with Indium Corporation’s internal sales and R&D teams to develop solutions for industry needs and requirements. She also collaborates with external customers and corporate partners to support the industry’s move toward heterogeneous integration. Some of her recent work includes the development of materials and processes for advanced packaging for fine-feature printing for SiP applications, as well as for one-step OSP ball-attach applications.
Hongwen Zhang leads technology development, product roadmapping, and the continued advancement of Indium Corporation’s materials portfolio. For nearly two decades, he has played a key role in advancing high-temperature, lead-free solder materials and strengthening the company’s metallurgical expertise. Zhang is a co-inventor of Indium Corporation’s Durafuse® technology, led the development of the BiAgX® alloy family—the first non-gold-based high-temperature lead-free solders—and has contributed to numerous customer collaborations and technical partnerships.
