LPMS USA, a leading provider of integrated low pressure molding solutions for electronics protection, will exhibit at the SMTA Guadalajara Expo & Tech Forum, October 7–8, 2026, at Expo Guadalajara. At Booth #347, LPMS will highlight low pressure molding technology and discuss how manufacturers can simplify electronics protection while improving access to equipment, materials, tooling, and technical support within Mexico.
A central focus of the exhibit will be LPMS USA’s Guadalajara warehouse and the advantages of establishing a more localized supply chain. For manufacturers operating in Mexico, purchasing and maintaining inventory locally can help shorten delivery times, improve material availability, and reduce costs and administrative requirements associated with international shipping, tariffs, and importation.
“Manufacturers in Mexico are looking for more than access to technology, they need a dependable supply and support structure around it,” said Brian Betti, President of LPMS USA. “Our presence in Guadalajara allows us to work more closely with customers, support local inventory strategies, and make it easier for manufacturers to implement and maintain their low pressure molding operations.”
Unlike conventional potting processes, low pressure molding uses thermoplastic materials and relatively low injection pressure to encapsulate electronics without damaging sensitive components. The process can combine environmental protection, strain relief, and the formation of an outer housing into a single manufacturing operation.
This approach can enable manufacturers to replace multi-component housings and eliminate several secondary production steps. Reducing the number of components, materials, and processes required for circuit protection can contribute to lower assembly costs, shorter cycle times, more compact product designs, and more efficient material use.