Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Flex Reports Q2 FY2027 Sales Growth of 25%, Record Adjusted EPS

10/30/2026 | Flex
Flex announced results for its second quarter ended September 25, 2026.

Kratos Wins $33.6M NASA Contract for Nuclear-Powered Spacecraft System

10/30/2026 | Globe Newswire
Kratos Defense & Security Solutions, Inc., a leading technology company in the defense, national security, and space domains, announced a $33.6 million contract award to design, build, and deliver the power conversion system for NASA’s Space Reactor-1 Freedom.

Iris Technology Secures Strategic Investment from OceanSound Partners

10/29/2026 | BUSINESS WIRE
OceanSound’s investment to strategically transform Iris into a leading independent provider of qualified electronics to national security space missions

EnerSys to Acquire Ultralife

10/28/2026 | BUSINESS WIRE
EnerSys, a global leader in stored energy solutions for industrial, infrastructure, and defense applications, announced that it has entered into a definitive agreement to acquire Ultralife for $16.00 per share in cash, representing a 166% premium to Ultralife’s unaffected closing share price on October 26, 2026.

Infineon to Build Europe’s First 300mm GaN Power Semiconductor Fab

10/27/2026 | Infineon
Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in