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Advanced Electronics Packaging Digest

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Suggested Items

Koh Young Brings Smart AI Solutions and Expanded True 3D Inspection Portfolio to SMTA Guadalajara 2026

09/08/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will bring its Smart AI Solutions and a broad portfolio of advanced inspection technologies to the SMTA Guadalajara Expo & Tech Forum, October 7–8, 2026, at Expo Guadalajara in Guadalajara, Jalisco, Mexico.

Koh Young Europe Highlights Smart AI Solutions at EFX Stuttgart

09/04/2026 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6 to 8, 2026, at Messe Stuttgart.

GÖPEL electronic Introduces New Multi Line AXI 3D-CT X-Ray Inspection System

09/03/2026 | GÖPEL electronic
For years, GÖPEL electronic has been a leader in the field of inspection and non-destructive, comprehensive assembly testing at all levels.

Inspectis Enhances BGA Inspection with New Robust Stainless-Steel Micro Probe

09/03/2026 | INSPECTIS AB
Inspectis AB has introduced a new Micro-Size Optical Probe Tip for its Ball Grid Array (BGA) Inspection System, offering improved image quality and a more robust design for inspection of solder joints beneath today’s increasingly small BGA packages.

Viscom Inc. to Showcase Latest AI-Powered Inspection Solutions at SMTA Mexico 2026

08/27/2026 | Viscom Inc.
Viscom Inc., will present its latest AI-powered inspection solutions at SMTA Mexico 2026, taking place from October 7–8 at the Expo Guadalajara Salón Jalisco.
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