Indium to Explore the Critical Materials and Packaging Process Connection at CPRIM 2026

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Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and reliability at the Conference on Advanced Packaging Reliability Technology and Interconnect Materials (CPRIM) 2026, September 4, in Guangzhou, China.

The presentation, titled Co-innovation of Materials and Processes for Advanced Semiconductor Packaging, examines how novel interconnect materials can help address critical process challenges in advanced semiconductor packaging. It will provide insights into heat-stable fluxes for thermocompression and laser-assisted bonding, ultra-low residue formations compatible with underfill materials, SiPaste technology for fine-pitch, high-density applications, and near-zero-residue bonding materials for fluxless assembly. Together, these solutions can help improve manufacturing yield, reliability, and process efficiency in increasingly complex packaging applications.

Luis Pan is a senior area technical manager for South China and is based at Indium Corporation’s Shenzhen facility. In this role, he manages the regional technical support team and partners with the company’s global organization to provide product and application solutions to customers. Pan has 20 years of experience in the electronics assembly industry, including SMT equipment, assembly processes, product design, and new product introduction. He earned a bachelor’s degree in automation from Southwest University of Science and Technology and is a certified project management professional and ISO 9001 internal auditor.