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Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging process challenges at PCIM Asia 2026, August 26-28, in Shenzhen, China.
The presentation, titled Next-Gen Advanced Packaging Materials and System Integration for Power Electronics, examines how advanced interconnection materials and process innovations work together to improve yield, reliability, and manufacturability in next-generation semiconductor packaging. The session will provide insights into breakthrough solutions for thermocompression and laser-assisted bonding, ultra-low residue fluxes, temporary adhesives, and fine-pitch printing technologies that can help manufacturers overcome complex packaging challenges while streamlining production and enhancing device performance.
Leo Hu is a senior area technical manager for East China and is based at Indium Corporation’s Suzhou facility. In this role, he manages the regional technical support team and partners with the company’s global organization to provide customer product and application solutions. Hu has 20 years of experience in semiconductor packaging, specializing in advanced assembly technology development, process improvement, and assembly materials applications. He has presented multiple technical articles at global forums and academic conferences and serves as a member and reviewer for the China SMTA Technical Advisory Committee. Hu holds a master’s in integrated circuit engineering from the Institute of Computing Technology, Chinese Academy of Sciences, and a bachelor’s in science from Nankai University.
PCIM Asia 2026 visitors can attend Hu’s presentation on Aug 26, 13:30–13:50 p.m. China Standard Time (UTC+8).
