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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.

Astera Labs Unveils Orion Rack-Scale AI Architecture

10/12/2026 | Astera Labs, Inc.
Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced Orion: a modular rack-scale reference design with production-grade connectivity that allows customers to choose their own GPU and CPU.

Infineon, ZuriQ Deepen Quantum Chip Partnership

10/08/2026 | Infineon
Infineon Technologies AG and ZuriQ AG, a Swiss quantum computing company spun out of ETH Zurich, today announced the expansion of their collaboration to advance scalable quantum computing hardware.

Chiplytics Raises $4.5M to Strengthen US Electronics Supply Chain

10/08/2026 | BUSINESS WIRE
Chiplytics, a pioneer in microelectronics verification technology, announced a $4.5 million funding round led by Scout Ventures and Waypoint Ventures and the opening of an inspection laboratory in Bellport, New York.

Advanced and Conventional PCBs Do Not Exist in Separate Supply Chains

10/08/2026 | Jan Pedersen, Engineer and PCB Expert
At the NCAB Norway seminar on Sept. 10, I used a familiar example: a standard six-layer PCB. A year earlier, this would generally have been a straightforward purchase. Prototypes could be supplied on quick turn, and production quantities were commonly available within four to six weeks. Choosing standard materials helped secure a competitive price and predictable delivery. We knew what to expect, and we planned accordingly. We were all happy!
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