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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Built for What’s Next: The End of Flat Thinking

11/05/2026 | Michael Gleason -- Column: Built for What’s Next
Advanced PCB design increasingly brings electrical performance, thermal behavior, mechanical requirements, material selection, and manufacturability into the same conversation. The board sits within a larger physical system, and each decision can influence how that system performs. Looking at those relationships together creates more opportunity to optimize the design as a whole.

DENSO Supports Next-Generation Mobility Talent Through EcoCAR Challenge

11/05/2026 | PRNewswire
DENSO, a leading mobility supplier, is sponsoring the EcoCAR Innovation Challenge, a four-year collegiate engineering competition that prepares students to become future leaders in mobility, technology and innovation.

ASC Sunstone Circuits to Showcase Advanced PCB Manufacturing Solutions at AEMS 2026

11/04/2026 | ASC Sunstone Circuits
ASC Sunstone Circuits announces that it will exhibit at the Anaheim Electronics & Manufacturing Show (AEMS) 2026, taking place November 10–11 at the Anaheim Convention Center in Anaheim, California.

Green Circuits Appoints David Kim as Vice President of Quality

11/04/2026 | Green Circuits
Green Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, has appointed David Kim as Vice President of Quality.

I-Connect007 Releases Episode 5 of ‘On the Line With… Qnity: Engineering What’s Next’ Podcast Series

11/04/2026 | I-Connect007
I-Connect007 announces the release of the fifth episode in its six-part podcast series, On the Line With… Qnity: Engineering What’s Next. This latest installment, titled “Engineering Heat Out of High-Power Systems,” examines the increasingly critical role of thermal management in electronics design and how innovative materials are enabling higher performance, greater reliability, and improved safety.
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