Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

CORSAIR PRO to Optimize Engineering Workstations, Servers and Clusters for Ansys Simulation

11/13/2026 | BUSINESS WIRE
Corsair Gaming, Inc., a leading global provider and innovator of high-performance products for gamers, streamers, content-creators, performance PC builders, and SIM Racing enthusiasts, has joined the Ansys Technology Partner Program, part of Synopsys, to deliver HPC systems that accelerate and simplify deployments.

Indium to Highlight Advanced Thermal Management Solutions for Supercomputing at SC26

11/13/2026 | Indium Corporation
Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a range of high-reliability, AI-enabling advanced materials at the International Conference for High Performance Computing, Networking, Storage, and Analysis (SC26), November 17-19, in Chicago, Illinois.

Incap, Rantelon Partner on RF and Electronic Warfare Technologies for Unmanned Systems

11/12/2026 | Incap
Incap Electronics Germany GmbH and Rantelon OÜ are establishing a sales and business development cooperation to bring advanced radio-frequency and electronic warfare technologies to manufacturers and developers of unmanned systems in the German-speaking market.

Scale-out: From Individual Servers To Interconnected Compute Systems

11/12/2026 | Chetan Arvind Patil, Marvell Technology
The semiconductor industry is moving beyond traditional chip-level scaling toward interconnected computing architectures. Growing demand for AI, high-performance computing (HPC), and data-intensive applications requires greater computing capacity, memory bandwidth, and communication efficiency. As we know, advanced packaging plays an important role in supporting the semiconductor technologies that enable these systems. While scale-up increases the capability of tightly coupled computing systems, scale-out enables those resources to work together at a larger infrastructure level.

Powering the Future: Why Engineers Are Switching to Ceramic Substrates

11/12/2026 | Brian Buyea -- Column: Powering the Future
Walk into any design review, whether it’s for an EV inverter, a radar system, or a high-frequency amplifier, and you’ll hear the same concern repeated in different ways: “How are we managing the heat?” That question, more than anything else, is driving one of the most important material shifts happening in electronics today. Engineers are moving deliberately and increasingly toward ceramic substrates. Not because they’re trendy, but because they solve problems that traditional materials simply can’t solve anymore.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in