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BEST Inc. Offers Interposer Rework and Precision Solder Ball Attachment Services

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BEST Inc., a leader in electronic component and PC services, is pleased to announce they offer interposer rework and precision solder ball attachment services. Interposer rework is an advanced process used to repair, replace, or modify the interposer that connects critical electronic components within high density assemblies.

Knocking Down the Bone Pile: Hot Air vs. Infrared PCB Rework

08/31/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Component rework is the controlled process of removing, replacing, repositioning, or repairing electronic components on an assembled PCB. Rework may be required because of component defects, incorrect placement, soldering defects, engineering changes, or damage identified during inspection or testing. A successful rework process uses controlled heating, soldering, cleaning, handling, and inspection techniques to restore the assembly while minimizing thermal and mechanical stress to the PCB and surrounding components.

The True Cost of Rework: Integrating RMAs and Rework into Core Business Processes

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Returns and rework are a reality for every manufacturer. Most companies can authorize an RMA. Fewer have the process or vehicles for carrying it through receiving, quality, production, shipping, and accounting. RMAs and rework can have a significant impact on the top and bottom line. Credits and refunds reduce revenue. Repair adds cost to a product already built and takes capacity away from new, revenue-producing work. Poor execution also puts customer relationships at risk, which is everything in contract manufacturing.

Kurtz Ersa Partners with E-tronix for Sales in Illinois and Wisconsin

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Kurtz Ersa Inc., a leading supplier of electronics production equipment, has entered into a new representative agreement with E-tronix to support customers in Illinois and Wisconsin. Under the agreement, E-tronix will provide sales support for Kurtz Ersa’s soldering, reflow, and rework equipment across the region.

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

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Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 
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