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Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

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Calumet Electronics Installs Fully Automated atg A9a and A9aL Flying Probe Technology for High-speed Electrical Test

08/04/2026 | atg Mycronic GmbH
Atg Mycronic GmbH and IEC USA confirm the delivery of high-speed bare board testing technology to PCB fabricator, Calumet Electronics, in Calumet, Michigan.

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Mega Circuit Chooses atg Flying Probe Technology for High-speed Electrical Test and Automation

07/31/2026 | atg Mycronic GmbH
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Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers

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I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, the newest title in its technical resources library. Written by reliability expert Bob Neves, the book examines one of the industry's most misunderstood topics: how to properly evaluate PCB via structures for assembly process survivability, long-term reliability, and robustness.
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