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Keiron Printing Technologies, the pioneer of Laser-Induced Forward Transfer (LiFT) precision solder paste printing, today announced it has closed a €20.7 million Series A round to end one of electronics manufacturing’s most expensive, unsolved problems – for good.
Solder paste printing is the single biggest point of failure in a global electronics assembly market worth more than €600 billion a year – and until now, no one has been able to fix it at the root. Responsible for over 70% of PCBA defects, it has quietly capped the reliability, speed, and yield of every electronics manufacturer on the planet. Keiron is the only company that has solved it: not by tweaking the old stencil-and-jet-printing playbook, but by replacing it entirely with a single digital, non-contact process.
The round is co-led by Invest-NL, DeepTechXL and Waves Capital, alongside existing and new investors, Ramphastos Investments, ATUM Ventures, Cottonwood Technology Fund and TNO Ventures. Keiron’s technology is increasingly recognized on the international stage – an endorsement reinforced by the investment from ATUM Ventures, a leading Singapore-based deep-tech fund, extending that recognition into Asia and underscoring Keiron’s ambition to become the global standard for electronics assembly.
Keiron's HF2 LiFT Printer eliminates the problem outright, replacing the stencil printer, jet printer, and SPI inspection system with one digital, non-contact platform: first-pass yield jumps from an industry-typical ~60% to above 95%, the production lead time reduces twice with zero stencils, production uptime raises twice higher, and the programming goes 10 times faster. All this enables higher throughput, lower working capital, improved cashflow, and stronger EBITDA for electronics productions in high mix low to medium volume environment. Nowhere is the payoff bigger than in next-generation AI hardware: components with up to 10,000 interconnects push conventional solder paste printing past its breaking point, leaving yields extremely low to date – exactly the gap Keiron’s fully digital LiFT process was built to close, carrying the legacy PCBA industry into Industry 4.0.
The new capital will fuel aggressive scale-up: ramping production, expanding commercial and support operations across Europe, North America and APAC, and accelerating R&D on Keiron's next-generation LiFT precision solder paste printing platforms.
“Solder paste printing has been the industry’s most expensive open secret for decades – a failure driver on a market worth well over €600 billion a year that everyone lived with because no one could fix it. This round lets us do exactly what the market has been asking for: put the HF2 on more lines, faster, without giving up an ounce of the precision that sets LiFT precision printing apart,” said Paul Rooimans, CEO and founder of Keiron Printing Technologies. “Keiron isn’t patching a problem the industry has lived with for decades. We’re removing it, for good.”
“AI, defense growth, and increasing manufacturing complexity are accelerating the need for digital transformation in EMS. Keiron solves one of the industry’s biggest production challenges with a scalable, digital approach to solder paste printing. That’s why we led the seed round and continue to back the company as it scales.” – Hessel Mittelmeijer, Investment Manager & Sustainability Officer.
Keiron's LiFT precision solder paste printing technology originates from TNO Holst Centre, a strategic collaboration between TNO and imec, and continues to be developed with TNO as Keiron's prime strategic research partner.
