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Advanced Electronics Packaging Digest

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Technica USA Demo Center Continues to Showcase Innovative Manufacturing Solutions

07/16/2026 | Technica USA
Technica USA welcomed another customer to its San Jose Demo Center this week, reinforcing the company's commitment to providing hands-on demonstrations, technical education, operator training, and application evaluations for customers across the PCB fabrication and PCB assembly industries.

The AI Data Center Boom: Technology, Capacity, and Society

07/17/2026 | Marcy LaRont, I-Connect007
AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.

PCB People Reports Record-breaking First Half as PCB Supply Chain Pressure Intensifies

07/15/2026 | PCB People
Record first-half performance driven by surge in demand from Electronic Manufacturers supports rapid customer growth, with new customers up 30% and new part numbers up 36% year-on-year.

Global Sourcing Spotlight: Making Global Sourcing Simple Again

07/15/2026 | Bob Duke -- Column: Global Sourcing Spotlight
If you’ve been in global sourcing long enough, you know the feeling of dashboards everywhere, endless reports, overlapping supplier databases, and “urgent” alerts that all say something different. What used to be a straightforward process of finding, qualifying, and managing suppliers has become a maze of tools, metrics, and meetings. Somewhere along the way, complexity became the norm.

Rebound Electronics Joins the Jabil Family

07/13/2026 | Rebound Electronics
Jabil, Inc. is proud to announce that Rebound Electronics is now part of the Jabil family of companies.
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