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I-Connect007 Releases New Guide Expanding on Qnity’s Engineering What’s Next Podcast Series

10/26/2026 |
I-Connect007 is pleased to announce the release of The Companion Guide to... Engineering What’s Next, an On the Line with... podcast series, a new publication that expands on the insights shared in the six-part series. As artificial intelligence, advanced packaging, and next-generation electronics continue to transform the industry, engineers face increasingly complex challenges in performance, reliability, thermal management, and sustainability. This guide explores why advanced materials—and the expertise to integrate them into practical solutions—are essential to meeting these demands.

I-Connect007 Releases New Guide Expanding on Qnity’s Engineering What’s Next Podcast Series

10/30/2026 | I-Connect007
I-Connect007 is pleased to announce the release of The Companion Guide to… Engineering What’s Next. This new publication expands on the insights shared in the six-part podcast series, On the Line with… Qnity: Engineering What’s Next. As AI, advanced packaging, and next-generation electronics continue to transform the industry, engineers face increasingly complex challenges in performance, reliability, thermal management, and sustainability. This new companion guide explores why advanced materials—and the expertise to integrate them into practical solutions—are essential to meeting these demands.

Companion Guide to Popular UHDI Podcast Series Now Available for Download

03/23/2026 | I-Connect007
The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/03/2025 | Andy Shaughnessy, I-Connect007
It’s been a busy week. We’ve been covering PCB West, and we’ll be bringing you a variety of news and interviews from the show in the next few weeks. We’ll also be attending SMTA International later this month, and productronica as trade show season rolls on. This week, we have a number of interesting columns and news items. We start with a positive story about North American PCB sales, which were heading in the right direction in August. Don Ball writes about the ins and out of working with overseas partners, and there’s a great column by Dan Beaulieu on avoiding the temptation to offer discounts when your customer gets squirrely.

New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!

09/29/2025 | I-Connect007
The final episode of the On the Line with… Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.
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