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It's Only Common Sense: Your Expertise Builds Your Brand

08/31/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Before a prospective customer ever calls you, visits your facility, or sends you an RFQ, there’s a good chance they’ve already checked you out. What did they find? Your website, technical articles, LinkedIn posts, case studies, and even what turns up in an AI search are forming an impression of your company before your salesperson ever gets in the door. Like it or not, that’s part of selling today.

Indium to Present Materials Solutions for the Next Wave of Power Electronics at CIPA 2026

08/26/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and assembly at CIPA 2026, August 31-September 2, in Wuxi, China.

Where Will the Next Generation of Great Engineers Come From?

08/26/2026 | Brian Buyea, Remtec
Most young engineers do not grow up dreaming about careers in ceramic substrates or plating processes. It’s not because these careers are uninteresting. In many cases, young people simply do not know they exist. They are excited about AI, robotics, aerospace, autonomous vehicles, space exploration, renewable energy, electric vehicles, medical technology, and advanced computing. What many students do not yet understand is that virtually every one of those technologies depends upon an incredibly sophisticated electronics manufacturing infrastructure.

Parsons Secures $514 Million Missile Defense Agency Contract Option

08/24/2026 | Globe Newswire
Parsons Corporation announced it has been awarded a $514 million contract option by the Missile Defense Agency (MDA) to continue providing engineering and technical support to the agency.

Indium to Present Next Gen Semiconductor Packaging Solutions at PCIM Asia

08/24/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging process challenges at PCIM Asia 2026, August 26-28, in Shenzhen, China.
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