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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

I-Connect007 Welcomes New Columnists from Flexible Circuit Technologies

08/12/2026 | I-Connect007
In an exciting new column for I-Connect007 Magazine, a team of application engineers from Flexible Circuit Technologies will draw on decades of experience designing and manufacturing flex and rigid-flex circuits to offer practical guidance to help PCB designers make better engineering decisions. Mark Finstad, Chris Clark, Terrill Schmidt, Dan Skweres, and Zack Schaner will rotate authoring the new column, called Flex Connections, which begins in the August issue, with Dan drawing on his many years of experience to explain why just because you can do something in PCB design, doesn’t mean you should.

Advanced Packaging, Materials Characterization, and System Integration: What’s Ahead in the Advanced Electronics Packaging Digest

08/11/2026 | I-Connect007 Editorial Team
The August issue of Advanced Electronics Packaging Digest explores how advanced packaging is reshaping semiconductor innovation through better materials characterization, heterogeneous integration (HI), workforce education, and system-level design. Together, these features examine the technologies and engineering decisions driving the next generation of electronic systems.

Nolan’s Notes: The CMMC Certification Question Mark

08/04/2026 | Nolan Johnson -- Column: Nolan's Notes
About a year ago, the Global Electronics Association published a report, “Interconnected: Global Electronics Trade in an Age of Disruption,” which made a convincing case that the electronics industry is the most globally interconnected industry on the planet. But those digital connections come with a warning label: Storing and transferring large amounts of intellectual property means facing data security challenges we’ve never seen before.

August SMT007 Magazine: Cybersecurity Remains a Business Imperative

08/03/2026 | I-Connect007 Editorial Team
Although the Department of Defense recently suspended its planned rollout of mandatory third-party CMMC certification while it reviews the program, cybersecurity expectations across the defense supply chain remain firmly in place. This issue of SMT007 Magazine explores why manufacturers continue investing in stronger security, what CMMC Level 2 certification involves, and how leading EMS companies are navigating the process.
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