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KYZEN’s Rueda and Bivens to Present at Parts Cleaning Conference 2026

06/25/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced that Fernando Rueda, KYZEN’s Global Product Line Director – Industrial, and Beth Bivins, KYZEN’s Global Product Line Manager - Solvents will each present at the 2026 Parts Cleaning Conference scheduled to take place Tuesday, July 7, 2026, at the Hilton Columbus Downtown in Columbus, OH.

Henger Captivates the 2026 JPCA SHOW in Japan with Next‑Generation Plasma Technolog

06/19/2026 | Henger
From June 10–12, 2026, Henger Microelectronics made a powerful appearance at the JPCA SHOW in Tokyo — one of the world’s most influential exhibitions for the electronic circuit and advanced packaging industries.

Dry Ice Blasting Offers Alternative Cleaning Method

06/15/2026 | Jonathan Dean, Cold Jet
Cleanliness is a critical factor in the production of every electronic component, from wafer fabrication to final product assembly. Unclean surfaces and parts can ruin entire batches of products, negatively affecting product performance, production yield rates, and overall operational costs. Any lapse in production quality or excessive downtime can be detrimental to an electronics manufacturing facility.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/05/2026 | Marcy LaRont, I-Connect007
It’s Friday, the sun is out here in Arizona, and AI is on my mind (and always in the news). So, AI seems like a good place for me to focus this week. My first recommendation for this week is an article I wrote about the e-glass (and copper foil) shortage now plaguing laminate and PCB fabricators as a result of the global market’s very heavy focus on AI-related tech, hardware products, and supporting infrastructure.

Key Considerations When Selecting an Aqueous Cleaning Agent

06/03/2026 | Adam Klett, Ph.D, KYZEN Corporation
Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.
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