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Scale-out: From Individual Servers To Interconnected Compute Systems

11/12/2026 | Chetan Arvind Patil, Marvell Technology
The semiconductor industry is moving beyond traditional chip-level scaling toward interconnected computing architectures. Growing demand for AI, high-performance computing (HPC), and data-intensive applications requires greater computing capacity, memory bandwidth, and communication efficiency. As we know, advanced packaging plays an important role in supporting the semiconductor technologies that enable these systems. While scale-up increases the capability of tightly coupled computing systems, scale-out enables those resources to work together at a larger infrastructure level.

Foxconn Showcases Pearl Satellites and Communications Technologies at TASTI 2026

11/09/2026 | Foxconn
Foxconn Technology Group is showcasing its latest developments in next-generation satellite communications at the Taiwan International Assembly of Space Science, Technology, and Industry (TASTI 2026), held November 8-10 at the Greater Tainan Convention and Exhibition Center.

Marvell-Lumentum Deal to Challenge Broadcom’s Market Leadership

11/04/2026 | TrendForce
Marvell has officially announced its acquisition of optical communications giant Lumentum, with both companies’ boards approving the transaction on November 2. The deal remains subject to shareholder and regulatory approval across multiple jurisdictions.

Marvell-Lumentum Deal to Challenge Broadcom’s Market Lead

11/03/2026 | TrendForce
Marvell has officially announced its acquisition of optical communications giant Lumentum, with both companies’ boards approving the transaction on November 2. The deal remains subject to shareholder and regulatory approval across multiple jurisdictions.

NASA Awards LeWiz Phase III Avionics Networking Contract

11/02/2026 | PRNewswire
LeWiz Communications, Inc. has been awarded a NASA Small Business Innovation Research (SBIR) Phase III contract to develop an advanced avionics networking system designed to improve communications and interoperability among spacecraft electronic systems.
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