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Advanced Electronics Packaging Digest

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Top 5 NAND Brands' Revenue Jumps 77% QoQ in 2Q26; Micron Rises to 3rd

08/18/2026 | TrendForce
TrendForce’s latest NAND Flash industry research reveals that AI server demand remained steady in the second quarter of 2026—particularly for enterprise SSDs—resulting in a supply shortage across the NAND Flash market.

Air Force Awards Intellisense $8.22M for Nuclear Flash Blindness Goggles

08/10/2026 | PRNewswire
Intellisense Systems, Inc. has been awarded an $8,218,891 Cost Plus Fixed-Fee (CPFF) Engineering and Manufacturing Development (EMD) and Low-Rate Initial Production (LRIP) contract to develop Next Generation Nuclear Flash Blindness protection systems to protect aircrews from nuclear flash blindness.

Kioxia, Sandisk Develop Highest-Density 3D QLC NAND

08/06/2026 | BUSINESS WIRE
Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation and Sandisk Corporation unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency.

NAND Flash Supply Growth to Outpace Demand in 2027, Easing Supply Constraints in 2H27

07/21/2026 | TrendForce
TrendForce’s monthly July NAND Flash update reveals that the NAND Flash market has remained undersupplied throughout 2026, driven by surging AI-related demand and limited capacity expansion.

The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps

06/01/2026 | Don Ball -- Column: The Chemical Connection
This month, I’m taking another look at additive manufacturing. What does mSAP, SAP, and additive metallizing (plating) look like in today’s advanced PCB fabrication? I must confess I don’t have a lot of insight, as my whole career has been devoted to removing copper from panel surfaces in even and controlled ways, and not to putting copper back on the panel. However, at some point in the additive process, especially in additive plating, copper must be removed from between the conducting surfaces to complete the circuits. Here, I can address some of the consequences of additive metallizing on subsequent etching steps.
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