Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Voyager, Penn State to Advance Pennsylvania’s Space Economy

07/15/2026 | BUSINESS WIRE
Voyager Technologies signed a memorandum of understanding (MOU) with The Pennsylvania State University, expanding the Voyager Institute for Space, Technology and Advancement (VISTA) ecosystem.

The Test Connection, Inc. Becomes First Test Engineering Company in Space

06/30/2026 | The Test Connection Inc.
TTCI recently contributed engineering time and resources to the Observation & Detection Interpreted by Neural-networks (ODIN) project, a student-developed payload by Capitol Technology University in Laurel, Maryland.

Rice Joins Axiom Space’s University Alliance

06/10/2026 | Rice University
Rice University has joined Axiom Space’s University Alliance, comprising 26 institutes from four continents and 12 nations working as an international network dedicated to advancing microgravity research, technology development and commercial innovation in low-Earth orbit.

Beagle 2: Lost Mars Lander Finally Honored with Plaques Across the UK

06/09/2026 | UK Space Agency
Beagle 2 touched down on Mars on Christmas Day 2003 but fell silent and was presumed lost for over a decade. In January 2015, NASA imagery confirmed it had landed safely and precisely on target — its silence likely caused by a single solar panel failing to fully deploy.

First Mold Expands University Partnerships to Build Next-Generation Manufacturing Talent Pipeline

06/05/2026 | PRNewswire
First Mold announced a long-term partnership with learning institutions, including universities, to enhance the development of skilled talent within their systems.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in