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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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GlobalFoundries Qualifies SLATE Packaging on 9SW Platform for RF Applications

06/26/2026 | GlobalFoundries
Manufactured at GF’s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027.

Sony, imec Unveil Backside Connectivity Module for 3D Chip Integration

06/18/2026 | Imec
At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, and Sony Semiconductor Solutions Corporation (Sony) jointly present a novel integration module for highly dense backside interconnects – key components of 3D stacking and backside functionalization technologies.

Atomera Breakthrough Targets Broader RF Adoption of GaN-on-Silicon

06/05/2026 | BUSINESS WIRE
Atomera Incorporated, a semiconductor materials and technology licensing company, announced a new approach to GaN-on-Silicon that addresses a key performance barrier limiting its use in mainstream RF applications.

Tight DRAM Supply Boosts Pricing Power, HBM Contract Prices Set to Surge in 2027

06/02/2026 | TrendForce
Sharp increases in conventional DRAM prices since the second half of 2025 have reflected an increasingly tight supply-demand environment.

Imec, EVG Demo Wafer-to-Wafer Hybrid Bonding at 200nm Pitch with Record Overlay Accuracy

05/28/2026 | PRNewswire
This week, at the 2026 IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies, and EV Group (EVG), leading provider of semiconductor manufacturing equipment and process solutions, present a robust and highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch, demonstrated on a test vehicle with routable interconnects.
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