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One Design, Many Minds: From Concurrent to Co-design

06/23/2026 | Marcy LaRont, I-Connect007 Magazine
For decades, hardware development has often looked like a relay race: Work is handed from the mechanical team to the electrical team to the RF team, and eventually back again, hopefully without too many expensive surprises waiting at the finish line. But as products become smaller, faster, smarter, and far more complex, that old-school “over-the-wall” workflow is starting to show its cracks.

Below the Surface: From Nanometers to 10-Gauge—It’s More Than Just a Wire

06/22/2026 | Chandra Gupta -- Column: Below the Surface
Modern life runs on wires: your cell phone, your car, the satellites orbiting above us, and even the dryer in your laundry room all depend on the simple idea of moving electricity from one place to another. From nanometer-scale traces etched onto a semiconductor chip to a thick 10-gauge copper wire carrying current to heat your clothes, it’s tempting to say, “It’s just a wire.” But that hides the real story. The magic isn’t the wire itself, but in the materials that insulate, protect, support, and connect it, often under extreme conditions of heat, voltage, vibration, and time.

Road to Reliability: The Foundational Technologies of Materials in EV Reliability

06/04/2026 | Stanton Rak, SF Rak Company
EV reliability is often discussed at the vehicle or system level, but many of the most persistent failures begin at the materials level. Semiconductor devices, ceramic substrates, die attach materials, wire bonds, clips, thermal interface materials, laminates, coatings, seals, and coolants define the electrical, thermal, and mechanical limits of the hardware. Once EV architectures move toward higher voltages, switching speeds, and power density, and longer service life, those materials are pushed harder, and small weaknesses can turn into large field problems

Beyond Design: How Signals Survive the Hostile PCB Environment

06/03/2026 | Barry Olney -- Column: Beyond Design
Modern digital signals exhibit behavior more characteristic of RF waveforms than the slow logic transitions of the past. With fast rise times, a PCB is no longer a collection of copper traces, but a distributed electromagnetic system. Successful design isn’t about routing signals anymore; it’s about engineering transmission lines, preserving uninterrupted return‑current paths, and controlling the resonant structures that naturally form within the multilayer PCB.

Don’t Call It Ground, Call It Return

04/09/2026 | Kristin Moyer, Global Electronics Association
If you’ve studied electrical or computer engineering, or have just read an electronics schematic, circuit diagram, or other application notes, you've likely seen the term “Ground,” often abbreviated GND. This is used in school and during the teaching of electronics circuit analysis to indicate a reference or zero-voltage node for circuit analysis. It is also taught that there is no current in GND since the voltage is zero. These are assumptions made for the purpose of simplifying the introduction to circuit analysis.
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