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Advanced Electronics Packaging Digest

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Foxconn Debuted EVs, AI Data Center at Japan-Taiwan Exhibition

07/20/2026 | Foxconn
Organized by the Foreign Trade Administration of Taiwan's Ministry of Economic Affairs and run by the Taiwan External Trade Development Council, the 2026 Japan-Taiwan Image Exhibition carried the theme "Innovate for Tomorrow: Taiwan and Japan Creating a Better Future Together.

Hitachi Energy, Eve Air Mobility Accelerate Electrification Infrastructure for Urban Air Mobility

07/17/2026 | Hitachi Energy
Hitachi Energy, a global technology leader in electrification, and Eve Air Mobility, an Embraer-backed electric vertical takeoff and landing (eVTOL) aircraft manufacturer, have signed a Memorandum of Understanding to advance the electrical infrastructure needed to support urban air mobility at scale.

Infineon, LS ELECTRIC Team Up on DC Power Solutions for AI Data Centers

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Delta Electronics (Americas) and X LABS Sign Technology Partnership MOU to Power Next-Gen AI Data Centers

07/15/2026 | Delta Electronics
Delta Electronics announced a Memorandum of Understanding (MOU) with X LABS, an investment manager and developer of islanded grids, to deliver energy-as-a-service (EaaS) to AI data center projects.

LITEON Advances Global Growth Strategy with $919 Million Investment in McKinney, Texas

07/14/2026 | LITEON Technology
LITEON Technology  announced a strategic investment of US$919 million to establish an advanced manufacturing facility in McKinney, Texas, including US$108.5 million for the acquisition of factory buildings.
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