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From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.

Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates

10/13/2026 | SEMI
Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported today in its latest 300mm Fab Outlook. Investment is expected to continue growing at double-digit rates through 2029, reaching $227 billion.

GlobalFoundries Unveils FD-SOI Platform for Physical AI

10/13/2026 | GlobalFoundries
GlobalFoundries (GF) unveiled plans for its new FDX Fusion™ FD-SOI platform, purpose-built for the evolving requirements of Physical AI.

Applied Materials, UCLA Accelerate Semiconductor Innovation at EPIC Center

10/09/2026 | Globe Newswire
Applied Materials, Inc. announced that the UCLA Samueli School of Engineering will join the company’s EPIC Center in Silicon Valley as a research partner.

Infineon, ZuriQ Deepen Quantum Chip Partnership

10/08/2026 | Infineon
Infineon Technologies AG and ZuriQ AG, a Swiss quantum computing company spun out of ETH Zurich, today announced the expansion of their collaboration to advance scalable quantum computing hardware.
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