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BAE Systems Honors Merlin Flex Ltd with a Partner 2 Win Silver Tier Award

05/18/2026 | Merlin Flex Ltd
Merlin Flex Ltd announced it received a Silver Tier Award from BAE Systems’ Partner 2 Win program. The award recognizes Merlin Flex Ltd exceptional performance and contributions to the BAE Systems’ Electronic Systems sector supply chain in 2025.

Delta Expands its R&D Capabilities in Soest, Germany with Opening of New R&D Center

05/18/2026 | Delta Electronics
Delta Electronics (Thailand) Public Company Limited, a global leader in power management and smart green solutions, today announced the official opening of its subsidiary, Delta Energy Systems (Germany) GmbH’s new Research and Development (R&D) center in Soest, Germany, significantly expanding its innovation capabilities in high-efficiency power solutions for AI and High-Performance Computing (HPC) data centers, as well as for electric mobility, including 800 VDC server power supplies and 4-in-1 EV power systems.

Kymeta Joins Red Cat Initiative for Maritime Connectivity

05/15/2026 | Globe Newswire
Red Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that Kymeta, a world-leading flat-panel satellite terminal manufacturer, has joined the Red Cat Futures Initiative, the company’s industry-wide consortium accelerating advanced autonomous systems for modern warfare.

SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding

05/14/2026 | BUSINESS WIRE
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.

Rethinking Reinforcement Materials for Advanced Packaging

05/14/2026 | Ivana Ivanovic, Flexiramics B.V.
Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
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