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Suggested Items

Connect the Dots: Design With the Quote in Mind

10/29/2026 | Kelly Atay -- Column: Connect the Dots
The quoting process has always been an important part of high-quality PCB prototyping and manufacturing. With supply chain disruptions and intensifying demand for domestically produced boards, that is even more true today. As we’ve previously discussed in recent articles or our book, "The Printed Circuit Designer’s Guide to… Designing for Reality," board designs are becoming more complex. Now, so is manufacturing them.

October I-Connect007 Magazine Spotlights MKS Inc. and PCB Manufacturing Challenges

10/15/2026 | I-Connect007 Editorial Team
Go inside MKS Inc., explore Thailand’s growing PCB industry, and find practical guidance on design and manufacturing challenges, from signal integrity and ceramic substrates to putting AI into factory operations.

I-Connect007 Welcomes Michael Gleason as New Columnist

10/14/2026 | I-Connect007
I-Connect007 welcomes Michael Gleason, director of product development and strategic growth at GreenSource Fabrication, as its newest columnist. His monthly column, Built for What’s Next, will appear in I-Connect007 Magazine, offering a forward-looking perspective on PCB design, advanced manufacturing, and the technologies shaping the next generation of electronics. With more than 20 years of experience in PCB manufacturing, Gleason brings a combination of engineering expertise, operational leadership, and practical knowledge of advanced fabrication.

I-Connect007 Welcomes Newest Columnist, Echo Yang of Archer Circuits

10/12/2026 | I-Connect007
I-Connect007 is excited to welcome Echo Yang, founder and president of Archer Circuits, as its newest columnist. As a female owner of a large Asian PCB company, Echo brings her candid, energetic, and practical view of the global PCB business to her column, The Fearless Connector. She will address the differences between Chinese and North American manufacturing, her own struggles to start a business, and some details about DFM, engineering, Gerber files, and the risks of treating RF, rigid-flex, and other demanding products like ordinary FR-4 work. She approaches it all with her own youthful, entrepreneurial spirit.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.
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