Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Memory Prices Soar; DRAM and NAND Flash to Account for 68% of Major CSP CapEx in 2027

08/25/2026 | TrendForce
According to TrendForce’s latest memory industry research, major global cloud service providers (CSPs) are accelerating AI infrastructure investment, with total CapEx projected to surge 98% YoY in 2026 and rise another 50% in 2027.

AI Server Shipments to Grow Nearly 31% in 2026 on CSP CapEx Boom

08/03/2026 | TrendForce
Surging investment in AI infrastructure is expected to drive the combined CapEx of the world’s nine largest CSPs up by approximately 90% YoY in 2026, according to TrendForce’s latest AI server research.

Server DRAM Contract Prices to Rise 13-18% QoQ in 3Q26 Amid Long-Term Price Caps

07/09/2026 | TrendForce
TrendForce’s latest memory pricing survey indicates that multiple memory suppliers have already factored in expected price hikes into their prices for the second quarter of 2026.

Optical Interconnects Drive AI Factory Growth; CPO/NPO Market to Top $39B by 2030

06/15/2026 | TrendForce
TrendForce’s recent research on silicon photonics (SiPh) shows that the rapid growth of AI training and inference workloads is pushing AI data centers toward increased power use, higher rack densities, and larger clusters.

Global AI Server Shipments Forecast to Grow Over 28% YoY in 2026

01/20/2026 | TrendForce
North American CSPs' continued investments in AI infrastructure are expected to increase global AI server shipments by more than 28% YoY in 2026, according to the latest market research from TrendForce.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in