Designing Without a Rulebook: When Engineering Becomes Innovation
May 5, 2026 | Stephen V. Chavez, Siemens EDAEstimated reading time: 1 minute
What if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed.
In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
When ‘Best Practices’ Stop Being Best
For most of our careers, PCB design has relied on proven guidelines, rules that ensure manufacturability, signal integrity, and reliability. These practices are built on decades of experience because they work.
But what happens when you’re working on something that hasn’t been done before? This could be designs for:
- Ultra-high-speed interconnects
- AI and HPC hardware pushing extreme bandwidths and power density
- Advanced packaging and heterogeneous integration
- Flexible and hybrid electronics
In these cases, the question shifts from “What’s the right way to do this?” to “Why was it ever done that way, and does it still apply here?” That’s a very different mindset and one that many teams are still learning how to navigate.
To continue reading this article, which appeared in the April 2026 I-Connect007 Magazine, click here.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
SPEA Expands Global Footprint with New Hub in Santa Clara, Silicon Valley
05/08/2026 | SPEASPEA has officially landed in the heart of Silicon Valley, with the grand opening of its newest facility in Santa Clara, California.
Nano Dimension Reports 106% YoY Revenue Growth in Q1 2026
05/08/2026 | Nano DimensionNano Dimension Ltd., a leader in digital manufacturing solutions, announced financial results for the first quarter ended March 31, 2026.
AI Demand Drives PCB Material Market Growth
05/08/2026 | TPCAAs AI computing continues to drive a comprehensive upgrade in hardware specifications, the global printed circuit board industry is undergoing a profound structural transformation.
Zhen Ding April 2026 Revenue Hits Record High on Strong AI Demand
05/07/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported April 2026 revenue of NT$15,196 million, up 11.83% YoY, reaching a record high for the same period in the company’s history.
ICAPE Group Reports Q1 2026 Revenue of €51.5 Million
05/06/2026 | ICAPE GroupQ1 2026 revenue of €51.5 million, up 2.2% compared to Q1 2025 (up +20% compared to Q1 2024), and up 4.6% compared to Q4 2025