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Advanced Electronics Packaging Digest

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EV Group Addresses Critical Manufacturing Challenges for Next-Generation Co-Packaged Optics

09/01/2026 | PRNewswire
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is actively engaged with customers and partners across the rapidly evolving co-packaged optics (CPO) ecosystem to support the needs of hyperscale data centers, AI infrastructure and high-performance computing (HPC) applications.

GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module

05/04/2026 | GlobalFoundries
GlobalFoundries (Nasdaq: GFS) (GF) announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).

STMicroelectronics Expands Silicon Photonics Production for AI Demand

03/09/2026 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters.

Myrias Optics Secures $2.1M Seed Funding to Advance Wafer-Level Metaoptics

02/25/2026 | PRNewswire
Myrias Optics, a world leader in wafer-level metaoptics and diffractive optical technologies, announced the closing of a $2.1 million Seed 1 financing round in January 2026.

Lightmatter, Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure

01/27/2026 | BUSINESS WIRE
Lightmatter, the leader in photonic (super)computing, announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that integrate Cadence’s silicon-proven, high-speed SerDes IP with Lightmatter’s Passage™ optical engine.
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