Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows

04/28/2026 | Zuken
Zuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.

EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space

04/28/2026 | ECIO
Every chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?

Cadence Reports Q1 2026 Financial Results

04/28/2026 | Cadence Design Systems
Cadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.

Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion

04/28/2026 | Tomachie
Tomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.

ASC Sunstone Circuits to Exhibit at PCB East 2026

04/26/2026 | ASC Sunstone Circuits
Anaya Vardya, President and CEO of ASC Sunstone Circuits, a leading provider of printed circuit board (PCB) fabrication and assembly solutions, announced that the company will be exhibiting at PCB East 2026, taking place April 29 at the DCU Convention Center.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in