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Horizon Sales Adds LPKF Laser and Electronics to Its Lineup
April 21, 2026 | Horizon SalesEstimated reading time: 1 minute
Horizon Sales, a leading manufacturers’ representative and distributor to the electronics industry, is pleased to announce a new partnership with LPKF Laser and Electronics, a global leader in precision laser technology. Through this partnership, Horizon will represent LPKF’s laser depaneling systems and laser stencil cutting solutions, expanding its portfolio of high-precision equipment for electronics manufacturing.
For more than 30 years, Horizon Sales has partnered with manufacturers to solve production challenges, streamline processes, and integrate advanced technologies. By adding LPKF’s laser depaneling and stencil systems, Horizon continues to provide Midwest manufacturers with solutions that enhance precision, improve yield, and support efficient production from prototyping through full-scale manufacturing.
Precision Laser Solutions for Electronics Manufacturing
Laser Depaneling Systems
- High-precision PCB depaneling with no mechanical stress
- Material Processing flexibility
- Clean edge quality ideal for sensitive components and advanced assemblies
- Flexible processing for complex board geometries
Laser Stencil Systems
- High-accuracy laser cutting for SMT stencils
- Consistent aperture quality for improved paste release and print performance
- Fast turnaround for prototyping and production stencil needs
“LPKF is a recognized leader in laser processing technology, and we’re excited to bring their depaneling and stencil solutions to our customers,” said Josh Casper, President of Horizon Sales. “These systems allow manufacturers to increase precision, reduce defects, and improve overall process control in critical areas of electronics assembly.”
With LPKF’s laser depaneling and stencil technologies now part of its offering, Horizon Sales continues its mission of connecting manufacturers with solutions that drive efficiency, reliability, and innovation—making complex processes simpler and more effective.
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Brent Fischthal - Koh YoungSuggested Items
Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
Bold Laser Automation Introduces Precision Laser Cleaning System for Advanced Manufacturing
03/27/2026 | PRNewswireBold Laser Automation, Inc. has introduced the LPCl1820UV Laser Precision Cleaning System, a Class 1, industrial laser platform engineered for high-precision surface cleaning and thin-film removal in demanding manufacturing environments.
CEA-Leti, NcodiN Partner to Industrialize 300 mm Silicon Photonics
03/11/2026 | NcodiNCEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process.
Altus Supports Ei Electronics with LPKF Laser Depaneling Technology
03/09/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics manufacturing industry, has supported Ei Electronics, Ireland’s largest manufacturer of home life-safety devices, with the installation of an LPKF CuttingMaster 2240 laser depaneling system to enhance PCB singulation and support growing production volumes.
Semtech Expands Data Center Portfolio with Acquisition of HieFo Corporation
03/05/2026 | SemtechSemtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.