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Knocking Down the Bone Pile: X-ray Inspection of Ball Grid Array Solder Joints
Zero Defects International (ZDI) has announced a significant increase in testing capacity for flying-probe ICT services. The addition of new state-of-the-art equipment enables ZDI to more than double throughput through higher equipment speeds, new operational efficiencies, and key personnel additions.
These upgrades and additions were necessitated by increased demand from the existing customer base, as well as new customer acquisitions. Further benefits of the new test system include greater precision in accessing fine features on printed circuit board assemblies [PCBAs], as well as enhanced parametric capabilities.
