Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work

04/28/2026 | JAVAD EMS
JAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.

TRI Launches New Wafer Inspection and Metrology Platform

04/28/2026 | TRI
Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.

Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies

04/27/2026 | Nolan Johnson, I-Connect007
This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.

GreenSource Fabrication to Exhibit at PCB East 2026

04/23/2026 | GreenSource Fabrication
GreenSource Fabrication, the N. American industry’s most advanced, state-of-the-art printed circuit board manufacturer, today announced that it will be exhibiting at PCB East 2026, on Wednesday April 29,2026 at the DCU Convention Center 50 Foster Street in Worcester, MA.

Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026

04/21/2026 | Koh Young America
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in