Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Viscom to Showcase the Next Generation of AI-Powered Inspection at SMTA International 2026

08/14/2026 | Viscom Inc.
At SMTA International 2026, Viscom Inc. will present how artificial intelligence is changing the way electronics manufacturers approach automated quality inspection – from intelligent programming to increasingly autonomous inspection processes. 

IPC Standards Released for Q2 2026

08/14/2026 | Global Electronics Association
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q2 2026.

High-Frequency High-Speed CCL Market to Reach $3.1B by 2035

08/13/2026 | Globe Newswire
The global high frequency high speed copper clad laminate market was valued at $4.5 billion in 2025 and is estimated to grow at a CAGR of 10.3% to reach $11.8 billion by 2035.

Koh Young Technology to Double Production Capacity as AI Server and Advanced Semiconductor Demand Grows

08/12/2026 | Koh Young
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, announced plans to expand its Yeoju production complex in Gyeonggi Province, Korea, with the construction of a second production center.

Teledyne to Acquire Varex Imaging Corporation

08/10/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated and Varex Imaging Corporation jointly announced that they have entered into a definitive agreement under which Teledyne will acquire all of the outstanding common shares of Varex for $18.90 per share payable in cash.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in